December 12, 2017 Press Release
Addresses data storage demands of increasingly complex applications including automotive information & entertainment systems and ADAS
TOKYO— Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has begun shipping samples of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1. The new products meet AEC-Q100 Grade2 requirements and support a wide temperature range of -40℃ to +105℃, offering the enhanced reliability capabilities that are required by increasingly complex automotive applications. The line-up meets a broad range of applications requirements with five different capacities: 16GB, 32GB, 64GB, 128GB and 256GB. 
The new products are embedded NAND flash memory products that integrate NAND chips fabricated with 15nm process technology and a controller in a single package. Storage requirements for automotive applications continue to increase as systems including automotive information & entertainment systems and ADAS become more sophisticated, and UFS supports their high performance and density needs. The addition of automotive UFS expands Toshiba Memory Corporation's line-up of embedded NAND flash memory products for automotive applications, which currently includes automotive e-MMC products. Utilizing the UFS interface allows the new products to achieve sequential read of 850MB/s and random read of 50kIOPs, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively.
Other new functions specifically suited to automotive applications have been added to the new UFS products, including Refresh, Thermal Control and Extended Diagnosis. Refresh can be used to refresh data stored in the UFS and can contribute to the extension of the data's life span. Thermal Control protects against overheating in the high temperatures that can occur in automotive applications. Extended Diagnosis helps users to understand the condition of the product.
Toshiba Memory Corporation's UFS products have been used to boost overall system performance in mobile devices, and the introduction of automotive UFS products is expected to have a similarly positive impact on the development of automotive information & entertainment systems and ADAS. Toshiba Memory Corporation is already in discussion with major automobile makers on the possibility of implementing the new line-up in next-generation projects. As the storage requirements for automotive applications continue to grow, Toshiba Memory Corporation will continue to lead the market by reinforcing its lineup of high-performance, high-density memory solutions targeting the sector.
|Interface||JEDEC UFS V2.1 standard
|Capacity||16GB, 32GB, 64GB, 128GB, 256GB|
|Power Supply Voltage||2.7-3.6V (Memory core)
|Temperature Range||-40℃ to +105℃|
|Product Name||Capacity||Package||Sample Date|
|THGAF9G7L1LBAB7||16GB||153Ball FBGA||11.5x13.0x1.0mm||Dec. 2017|
|THGAF9G8L2LBAB7||32GB||153Ball FBGA||11.5x13.0x1.0mm||Dec. 2017|
|THGAF9G9L4LBAB8||64GB||153Ball FBGA||11.5x13.0x1.2mm||Dec. 2017|
|THGAF9T0L8LBAB8||128GB||153Ball FBGA||11.5x13.0x1.2mm||Dec. 2017|
|THGAF9T1LBLBABY||256GB||169Ball FBGA||12.0x16.0x1.6mm||2Q, 2018 (Apr. - Jun.)|
*Company names, product names, and service names mentioned herein may be trademarks of their respective companies.
Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.
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